MediaTek has diversified its chip packaging strategy by incorporating Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology alongside TSMC's CoWoS and SoIC services. This strategic shift addresses the limited advanced packaging capacity at TSMC, which is heavily allocated to high-volume clients like Nvidia. MediaTek's move aims to mitigate risks associated with relying solely on TSMC, especially as it targets a significant share of the AI ASIC market by 2028. Intel's EMIB technology offers advantages such as improved yield, reduced warpage, and lower costs, making it suitable for inference-type ASICs. This development follows MediaTek's hiring of Douglas Yu, a former TSMC executive, although the company denies any direct collaboration with Intel post-hire. MediaTek's strategy highlights the growing importance of flexible packaging solutions in the semiconductor industry, where demand for AI chips continues to exceed packaging capabilities.