Huawei has unveiled a 122.88TB solid-state drive (SSD) using its new Die-on-Board (DoB) packaging technology, circumventing US sanctions that restrict access to advanced chip technology. The announcement was made during Huawei's ID Forum events held from May 21 to May 23, 2026. The company also introduced a 61.44TB model and revealed plans for a 245TB variant. The DoB packaging method allows NAND flash memory dies to be mounted directly onto the printed circuit board, increasing capacity density by 33% compared to traditional methods. This innovation is a strategic response to US export controls, which limit Huawei's access to cutting-edge components. The SSDs utilize NAND flash from China's YMTC, leveraging its Xtacking 4.0 technology, although it remains behind international competitors in terms of layer count. Huawei's new SSDs are integrated into the OceanStor Pacific 9926 system, targeting AI inference and large-scale data center workloads. The company also announced plans to form an AI SSD Innovation Alliance to enhance AI performance through optimized software layers, highlighting its focus on AI infrastructure despite ongoing sanctions.