TSMC plans to raise its wafer foundry prices by up to 10% starting in 2027, according to sources cited by Nikkei Asia. The price hikes will affect both advanced and mature process chips, driven by rising costs of materials, manufacturing equipment, and overseas fab construction. The company has begun discussions with customers, with increases ranging from 5% to 10% depending on the customer and product. For high-performance computing (HPC) chips, TSMC intends to add a premium of 10% to 15% for orders exceeding initial forecasts, potentially pushing some advanced process chip prices beyond a 10% increase. The mature process segment, which includes 12nm, 16nm, and 28nm processes, will see a maximum increase of 10%, though some products may experience smaller hikes. These changes are set to take effect in early 2027.