SK Hynix announced that its DRAM and high-bandwidth memory (HBM) production capacity is effectively sold out for the next three years through 2029, significantly strengthening its long-term sales outlook. The disclosure came during the company's earnings call on October 28. The chipmaker completed shipments of next-generation HBM4E samples in the second quarter, with HBM4 development and certification progressing in line with customer timelines. The near-total capacity commitment underscores surging demand for advanced memory solutions driven by AI infrastructure expansion.