Huawei has unveiled the 'Tau Law' at ISCAS 2026, marking China's first major contribution to global semiconductor design principles. Announced by He Tingbo, Director of Huawei and President of the Semiconductor Business Unit, the Tau Law focuses on reducing signal propagation delays rather than relying on extreme miniaturization of transistors. This approach, termed 'logic folding,' involves stacking circuit layers to shorten interconnect distances, thereby enhancing chip performance. Over the past six years, Huawei has produced 381 chips adhering to the Tau Law, with plans to release a Kirin chip featuring this technology in autumn 2026. By 2031, Huawei aims to achieve performance levels equivalent to a 1.4-nanometer process. Key companies involved in this initiative include Huada Jiutian, Primarius Electronics, and Tongfu Microelectronics, among others, who are pivotal in EDA tools and advanced packaging technologies essential for implementing the Tau Law.